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Reducing amount of helper data in silicon physical unclonable functions (PUFs) via lossy compression
Background
Silicon physical unclonable functions (PUFs) are widely used in emerging hardware security applications, such as device identification, authentication, and cryptographic key generation. PUFs generate unique randomness by exploiting inherent random process variation during fabrication. Among them, static random-access memory (SRAM) PUFs that...
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Wafer alignment with AFM metrology
Background
One of the major challenges in nanoscale manufacturing is defect control. Optical inspection is not an option at the nanoscale level due to the diffraction limit of light, and without inspection high scrap rates can occur. One solution to this problem is inline metrology using atomic force microscopes (AFM). Single chip MEMS based AFMs have...
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Analog-to-digital converter (ADC) technologies
Background
Dr. Nan Sun and his research group have developed a portfolio of analog to digital converter (ADC) technologies that are available for licensing. Overall, Dr. Sun’s lab develops high-performance analog/mixed-signal circuits and architectures, with research efforts focusing primarily on designing low-power, high-speed, and high-resolution...
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Through silicon vias (TSV)
Through silicon vias (TSV) is a key enabling element the provides short vertical interconnects in die stacks to improve electrical performance, power consumption, and form factor for 3D integrated devices. The mismatch of thermal expansion coefficients between the copper via and the silicon wafer can induce significant thermal stresses to degrade the...
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Novel AC-AC converter
BackgroundThe 60Hz transformer has been around for more than 100 years. It does one job, convert one AC voltage to another. Using power electronic AC/AC converter to replace this has the potential advantage of lower size and more functionalities. However, today there is a short coming in the AC/AC converter topology/circuit. This invention intends to...
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Step-down DC/DC converter
Background
The 48V power architecture is one of the more recently introduced architecture to improve computer power supply efficiency. However, conversion from 48V to 12V or down to ~1V needed by the CPU is a grand challenge. Efficiency and footprint are the key drivers as the converter is placed on the motherboard. Previous methods include Buck, Switch...
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STO/LAO quantum well structures
Background Electro-optic modulators play a key role in global communications and data transfer infrastructure. Most notably, they form the basis for optical transceiver technologies which connect high-throughput data centers to long-haul fiber optic communications lines. Due to rapidly expanding global data demands, the performance of such devices,...
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Large Pockels coefficient in BaTiO3 (BTO) devices
BackgroundThe explosion of global data rates has led to an increased reliance on optical transceiver technologies for high-throughput data centers and high-performance computing. Photonic integrated circuits improve the performance of optical technologies and reduce their cost. Many key elements in photonic integrated circuits, such as modulators and...
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